Immersion cooling a.k.a. liquid submersion cooling is the practice of submerging computer components (or full servers) in a thermally, but not electrically, conductive liquid (dielectric coolant) allowing higher heat transfer performance than air - plus many more benefits!
The very first commercially immersion cooling system designed according to OCP principles. A compact, modular LIC solution with >100kW dissipation capacity and a PUE <1.03. Accommodating 21” and/or 19” HW and a flexible busbar system supporting multi-zone 12v & 48v configurations.
A mPUE of 1.04 & a PUE lower than 1.10
Save 25-40% on TCO
Increase in computing density
Reduce latency and increase speed deployment
Increase HW life-span
Better conditions for IT Hardware
Save 50% on CAPEX building costs
Dramatic OPEX reduction
Reduce water consumption
Integration to heat-reuse solutions
HPC Solutions
Edge Solutions
AI and ML Solutions
Cloud Solutions
Want to roll-out Immersion Cooling in your new or existing infrastructure?
Submer delivers turnkey Immersion Cooling technology including primary cooling, secondary cooling, resilient pump-sets all the way to certified hardware with a guaranteed unrivalled end to end PUE, anywhere on the globe.
Compare an air cooled and a Submer cooled Datacenter.
Whether you've never of immersion cooling, if you're just curious about liquid and electronics coexisting, or if you want to make your datacenter smarter and more sustainable, this Submer eBook will answer your W's!
Ask questions & tell us more about your upcoming datacenter/HPC or Hyperscale project. We're here to help!
